Advanced packaging and heterogeneous integration play an increasingly important role in the further development of the European semiconductor industry. They make it possible to bring different technologies, functions, and components closer together, thus forming an important link between research, application, and market introduction.
On Tuesday, May 12, 2026, the webinar From Lab to Market: How APECS and ChipNL enable advanced packaging in Europe takes place. This online session is the first webinar in the aCCCess series on European Pilot Lines and focuses on the APECS Pilot Line.
During the webinar, participants will gain insight into APECS's technologies and services in the field of advanced packaging and heterogeneous integration. It will also be explained how APECS collaborates with Chips Competence Centres, including ChipNL Competence Centre, to better connect access to pilot lines with the needs of national ecosystems.
From ChipNL CC, Mark Luke Farrugia, Partnership Manager ChipTech Twente / ChipNL Competence Centre, shares how ChipNL CC helps bring European pilot lines closer to the Dutch semiconductor ecosystem. This aligns with the role of ChipNL CC: providing overview, connecting parties, and helping organizations find their way to relevant expertise, networks, and facilities.
Program
Introduction to the APECS Pilot Line technologies
Erik Jung, Senior Business Developer APECS Pilot Line, Fraunhofer
APECS access strategies, collaboration with Chip Competence Centers, joint activities with ChipNL
Félix Mohn, Manager Business Development, APECS Pilot Line, Research Fab Microelectronics Germany
ChipNL’s perspective on the APECS Pilot Line: how ChipNL brings the pilot lines to the Dutch ecosystem
Mark Luke Farrugia, Partnership Manager ChipTech Twente / ChipNL Competence Centre
Practical information
Date: Tuesday, May 12, 2026
Time: 10:00 AM – 11:00 AM
Location: online
Cost: free
Language: English
For whom?
This webinar is relevant for companies, knowledge institutions, and other organizations that want to learn more about advanced packaging, heterogeneous integration, and the possibilities of European pilot lines.
