Innovation Mission Germany: Integrated Photonics and Advanced Packaging

LocationGermany
OrganisationRVO, Innovatie Attaché Netwerk
Date28-09-2026 - 02-10-2026
Register

From September 28 to October 2, 2026, the Netherlands Enterprise Agency (RVO), together with the Innovation Attaché Network, is organizing an innovation mission to Germany focusing on integrated photonics, advanced packaging, and heterogeneous integration.

The mission is intended for professionals from companies and knowledge institutions active in semiconductors and integrated photonics. Participants will have the opportunity to meet with relevant German companies, research institutions, and regional clusters in Saxony and Berlin-Brandenburg.

Collaboration and Market Opportunities in Germany

Germany has a strong manufacturing industry and important end markets, such as automotive, aerospace, medical, and defense. Additionally, the country possesses a robust ecosystem in microelectronics, photonics, and sensor technology.

During the mission, the focus will be on connecting the Dutch and German ecosystems. Participants will explore possible research collaborations, business opportunities, and access to German end markets. There will also be attention to large German projects and initiatives, including the APECS Fraunhofer Pilot Line.

For Dutch organizations working on integrated photonics, advanced packaging, or heterogeneous integration, this mission offers a practical opportunity to make new contacts, gather market information, and further explore potential collaborations.

Concept Program

The program is still under development. The mission starts on Monday, September 28 with a travel day to Dresden and a kick-off in the evening.

In the following days, company visits, networking events, and visits to research and innovation partners are on the agenda. The mission will visit, among others, Dresden and Berlin. There will also be opportunities to connect with clusters and end users from various sectors.

On Friday, October 2, the mission ends in Berlin, with a possible company visit and opportunity for individual appointments.

For Whom?

This innovation mission is intended for professionals from companies and knowledge institutions working on semiconductors, integrated photonics, advanced packaging, and heterogeneous integration.

Practical Information

Date: Monday, September 28 to Friday, October 2, 2026
Location: Germany, including Dresden and Berlin
Cost: € 350 excluding VAT per person

The mission is small-scale. RVO aims for one participant per organization. Final participation depends on the number of available spots and the alignment of expertise with the scope and purpose of the mission.

Register

Do you want to participate in the innovation mission? Then register via the online registration form of RVO.

Register via RVO